Infineon Technologies AG said Monday that it has bought Dresden-based startup Siltectra GmbH for 124 million euros ($140.5 million), according to a report from Dow Jones Newswires supplied to EFE on Monday.

The German chip maker said it will use a technology developed by Siltectra, called Cold Split, to split silicon-carbide wafers and double the number of chips that can be produced from one wafer.

"Thanks to the Cold Split technology, the higher number of SiC wafers will make the ramp up of our SiC products much easier," said Chief Executive Reinhard Ploss in a statement.

By Alberto Delclaux